Description

The SEMPrep 2 model is equipped both with high- and low-energy ion sources. Rapid slope cutting with the high-energy ion gun followed by gentle surface cleaning with the low-energy ion gun provides cross-sectional SEM samples suitable for semiconductor failure analysis and other analytical purposes. The system also provides an ion milling based solution for improving and cleaning of mechanically polished SEM samples and preparation of damage-free surfaces for EBSD technique. The new 16 keV ultra-high energy ion source is more powerful and has higher sputtering rate as before.

For high-quality site-specific sample preparation in SEM application

• Cross-sectional sample preparation by slope cutting in 90°, 45° and 30° by different sample holders
• Final polishing and cleaning of traditional SEM and EBSD samples
• Load-lock system for faster and easier sample exchange
• High-energy ion gun for rapid milling
• Optional ultra high-energy ion gun specially recommended for ion milling extra hard materials or for extreme fast milling
• Low-energy ion gun for gentle surface polishing and cleaning
• Automated parameter settings and operation
• Sample rotation and oscillation
• Real-time monitoring of the milling process by high-resolution CMOS camera and TFT monitor