Xe FIB Models
TESCAN SOLARIS X
TESCAN SOLARIS X
Key features
Key features
A Plasma FIB-SEM platform for deep sectioning and the highest resolution end-pointing for package level failure analysis
A Plasma FIB-SEM platform for deep sectioning and the highest resolution end-pointing for package level failure analysis
- Curtaining-free large-area cross-sectioning for physical failure analysis of advanced packaging technologies
- Prepare large area FIB-cross-sections up to 1 mm wide
- Obtain low noise, high-resolution image at low keVs in short acquisition time at FIB-SEM coincidence with the sample tilted
- Live SEM-monitoring during FIB milling for precise end-pointing
- Observe the most beam-sensitive materials using low keVs ultra-high resolution for surface sensitivity and high material contrast
- Effective techniques and recipes for fast and artefact-free cross-sectioning of composite samples (OLED and TFT displays, MEMS devices, isolation dielectrics) at high currents
- Essence™ easy-to-use modular user interface
TESCAN AMBER X
TESCAN AMBER X
Key Features
Key Features
A unique combination of Plasma FIB and field-free UHR FE-SEM for multiscale materials characterization
A unique combination of Plasma FIB and field-free UHR FE-SEM for multiscale materials characterization
- High throughput, large area FIB processing up to 1 mm
- Ga-free microsample preparation
- Ultra-high resolution, field-free FEG-SEM imaging and analysis
- In-lens SE and BSE detection
- Resolution optimization for high-throughput, multi-modal FIB-SEM tomography
- Superior field of view for easy navigation
- Essence™ easy-to-use, modular graphical user interface
