STEM-BF image of an 80 nm thick TEM lamella from a 65 nm DRAM node
Key features
A Plasma FIB-SEM platform for deep sectioning and the highest resolution end-pointing for package level failure analysis
Curtaining-free large-area cross-sectioning for physical failure analysis of advanced packaging technologies
Prepare large area FIB-cross-sections up to 1 mm wide
Obtain low noise, high-resolution image at low keVs in short acquisition time at FIB-SEM coincidence with the sample tilted
Live SEM-monitoring during FIB milling for precise end-pointing
Observe the most beam-sensitive materials using low keVs ultra-high resolution for surface sensitivity and high material contrast
Effective techniques and recipes for fast and artefact-free cross-sectioning of composite samples (OLED and TFT displays, MEMS devices, isolation dielectrics) at high currents
Essence™ easy-to-use modular user interface
TESCAN AMBER X
1 mm wide polished cross section of a Li-ion battery electrode
EBSD map of a 90 µm diameter cold-drawn copper wire
Key Features
A unique combination of Plasma FIB and field-free UHR FE-SEM for multiscale materials characterization
High throughput, large area FIB processing up to 1 mm
Ga-free microsample preparation
Ultra-high resolution, field-free FEG-SEM imaging and analysis
In-lens SE and BSE detection
Resolution optimization for high-throughput, multi-modal FIB-SEM tomography
Superior field of view for easy navigation
Essence™ easy-to-use, modular graphical user interface