An alternative solution for semi-automated high-quality TEM lamella preparation
Low-kV ultra-high-resolution imaging of high-end semiconductor devices
Precise end-pointing at low electron beam energies
Gentle FIB thinning for improved quality results in TEM sample preparation enabled by excellent low-kV ion beam performance
Optimized workflows and recipes for easy preparation of ultra-thin TEM lamellae
Semi-automated software module for site-specific TEM lamella preparation
Preparation of advanced geometry TEM lamellae from the most advanced semiconductor nodes
Specialized, load-lock-compatible stage carousel for TEM sample preparation
Dedicated TEM grid holders with fully optimized geometry for advanced TEM sample preparation
World-class quality in sample preparation with excellent performance at low energies for preparing damage-free ultra-thin TEM specimens.
TESCAN AMBER
Array of micro-compression pillars
A cross section through a defect in a multi-layered coating
Wide Field mode for large sample imaging and navigation
Key features
Versatile nanoanalytical FIB-SEM to expand your materials research capabilities
High precision micro sample preparation
Ultra-high resolution field-free SEM imaging and nanoanalysis
Extended field of view and easy navigation
Multi-site process automation
Multi-modal FIB-SEM tomography
Easy-to-use modular software user interface
Attractive optional packages for various applications
TESCAN LYRA 3
Key features
High Performance Electron Optics
Unique Wide Field Optics™ design with a proprietary Intermediate Lens (IML) offering a variety of working and displaying modes, for instance with enhanced field of view or depth of focus, etc.
Real time In-Flight Beam Tracing™ for performance and beam optimization, integrated with the well-established software Electron Optical Design. It also includes a direct and continuous control of the beam spot size and beam current.
Fully automated electron optics set-up and alignment
Fast imaging rate
A unique live stereoscopic imaging using the advanced 3D Beam Technology which opens up the micro and nano-world for an amazing 3D experience and 3D navigation.
High Performance Ion Optics
Sophisticated high performance CANION FIB system for fast and precise cross-sectioning and TEM sample preparation.
Optional ultra-high resolution COBRA-FIB column represents the highest level of technology in terms of resolution both for imaging and milling. This is one of the most precise FIB instruments for nano-engineering in the world.